Master Bond offers heat cure epoxy system suitable for medical applications
Master Bond
EP3HTSMED epoxy system
Developed for rigorous bonding and sealing in demanding manufacturing applications, the EP3HTSMED epoxy system from Master Bond features a rapid cure schedule and tensile shear strength exceeding 1,000psi.
Master Bond claims that the thixotropic paste is 100 per cent reactive and fully meets USP Class VI requirements for medical applications.
The EP3HTSMED is resistant to severe thermal cycling and many chemicals, including water, fuels, oil and most organic solvents.
The no-mix epoxy bonds well to a variety of substrates, including metals, glass, vulcanised rubbers, ceramics and many plastics.
Key specifications
- Volume resistivity of less than 0.001Ωcm
- Serviceable temperature range of -60F to +400°F
- Cures at 300°F in 20–40 minutes
- Cures at 250°F in 40–90 minutes
- Shelf life of six months in a glass jar
- Shelf life of three months in a syringe at room temperature
- Shore D hardness of 60 to 80
- Specific gravity of 2.90 at 77°F
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