Product brochure: Goepel Opticon X-Line 3D for 3D void inspection
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Product brochure: Goepel Opticon X-Line 3D
The Goepel Opticon X-Line 3D provides various features for 3D void inspection.
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Since its standardisation as IEEE 1149.1 in 1990, JTAG/boundary scan has developed to become one of the most important test technologies. This white paper from Goepel Electronics analyses the current technology state, provides support in the systematic categorisation of available solutions and gives an outlook of the technology’s future.
Variotap from Goepel Electronic is a single, integrated platform for Emulation and Boundary Scan. It is based on special device models and is tightly integrated in the System Cascon development environment.
Users can perform comprehensive 3D X-ray inspection using Goepel Electronic’s Opticon X-Line 3D system.
Goepel Electronic’s Opticon X-Line 3D units can be used to inspect double-sided equipped printed circuit boards (PCBs).
Goepel Electronic’s Chameleon optical inspection module adds angled-view functionality to Opticon systems.