Optotherm updates thermal imaging
Optotherm
thermal imaging system
Optotherm has updated its Micro thermal imaging system for semiconductor failure analysis.
It includes a thermal imaging camera with 320 x 240 element, uncooled detector and 0.05C sensitivity, 20-micrometre microscopic lens, wide-angle lens, and 16-bit digital Camera Link interface.
As electronic devices continue to decrease in size, heat generation and thermal dissipation become increasingly important.
Micro can measure and display the temperature distribution over the surface of semiconductor devices, enabling quick detection of hot areas that can decrease efficiency and frequently lead to early failure.
Other applications include calculating thermal resistance, measuring junction temperature and identifying die bond defects.
A complete Micro system includes thermal imaging camera, tower computer and monitor, mounting platform, vertical camera stage, XY table, thermal chuck with controller, and I/O relay module.
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