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Lord
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Underfill encapsulant for semiconductor packaging
Lord has released a low-cost underfill encapsulant that has been developed specifically for the semiconductor packaging and assembly industries.
Lord introduces SC-305 silicone encapsulant
Lord has announced the availability of Lord SC-305, a thermally conductive silicone encapsulant designed for encapsulation applications where high heat dissipation is required.
Lord adhesive for electronics, LED and solar uses
Lord has released a low-modulus, high-thermal-conductivity adhesive suitable for the electronics, LED and solar industries.
Lord scientist to present lecture at Imaps
Russell Stapleton PhD will speak at the International Microelectronics and Packaging Society (Imaps) Arizona Chapter in Mesa on 26 August 2009.
Lord TC-501 Grease doesn't pump out
Lord has announced the availability of a thermally conductive grease that does not pump out.
