Imaps-UK announces Beyond Solder seminar details
IMAPS
Beyond Solder seminar
Imaps-UK has released details of the technical programme for its forthcoming Beyond Solder seminar, which is due to be held at the National Physical Laboratory in London on 30 June 2010.
With its theme of interconnect processes, technologies and materials, the event has attracted presenters from companies and institutions such as IeMRC, Henkel, TWI, Kulicke and Soffa, Panda Europe, NPL and Irisys.
The one-day seminar comprises seven technical presentations, including: 'Joining and Packaging Technology for High Temperature Electronics'; 'Ultrasonically Bonded Copper Interconnects'; 'Press-fit Connections For High Reliability and Automotive Applications'; 'End-Of-Life Options For Electronic Interconnects'; 'Innovative Adhesive Technologies'; 'Bonding With Nanotechnology'; and a keynote presentation from the IeMRC addressing 'The Benefits, Challenges and Opportunities For Solder-free Connections'.
The event is open to everyone, including non Imaps-UK members; the remaining spaces are available on a first-come, first-served basis.
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IMAPS-UK announces 'Beyond Solder' seminar
IMAPS-UK has announced a one-day technical seminar, entitled 'Beyond Solder', which will be held on 30 June 2010 at the National Physics Laboratory.
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