Hectronic COM modules have extended temperatures
Hectronic
H6046/H6049 COM modules
Hectronic has announced two extended-temperature COM modules based on the Intel Atom processor.
The products are developed to meet demand for low-power computer boards specified for harsh environments.
The products are based on the H6046 ETX module and the H6049 module in the Qseven form factor.
H6046 and H6049 have previously been available specified for 0 to 60C, a common temperature range for industrial computer boards.
This product announcement adds two temperature ranges, from -25 to 70C and from -40 to 85C.
Conformal coating of the board is optional.
These COM modules target applications in markets such as transportation, defence, test and measurement, as well as process control and industrial automation.
H6046 and H6049 are based on a 1.1 or 1.6GHz Intel Atom Z510/Z530 CPU and Intel System Controller Hub US15W.
H6046 has onboard PCI Express to PCI and LPC to ISA bridges.
The H6046 in the 1.6GHz version supports the ETX 3.0 standard, which means that SATA is supported.
Both COM modules have soldered DDRII memories for improved resistance to shock and vibration.
The ETX module has onboard sockets for industrial Flash SSD and SD cards.
The Qseven module has a soldered onboard BGA Flash SSD.
The H6046 and H6049 have an approximate power consumption of 7 and 5W, respectively.
H6049 targets highly integrated and compact volume products that require low production costs.
Measuring 70 x 70mm, it is suited for handheld devices.
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