Ericsson offers customised DC/DC module

Ericsson's Customer Specified Products group provides optimised solutions for applications where off-the-shelf products do not match customer specification 100 per cent.

The BMR653 3+ was designed to power an intermediate bus voltage requiring 12V at 60A, in an application where board space was the most critical parameter - limited to standardised quarter-brick footprint.

It offers a power density of 13.9W/cm3 (184W/in3) and can power applications such as routers, optical switches, data-storage, ATCA, MicroTCA, embedded computing and many others where board space is critical.

The BMR653 3+ is for use in any application that demands high power in combination with a small footprint while using forced air-cooling.

Traditionally, such power levels are offered in the so-called half-brick package size (35cm2 - 5.47in2), whereas the BMR653 3+ with its quarter-brick footprint (21.3cm2 - 3.3in2) saves on board space.

Maintaining compatibility with the standardised quarter-brick format makes it possible for customers to adjust the power solution when upgrading central processors or adding storage capacity, without having to redesign all of the board.

With its high efficiency figure of 96 per cent (typical at 12V out, 50 per cent load and 48V in), the BMR653 3+ simplifies thermal management.

As a stacked product it is designed to provide efficient airflow through the module, thus reducing airflow resistance and further improving thermal performance.

The BMR653 3+ features an input voltage range of 36 to 75V, and offers 1,500V DC input to output isolation.

Protection is provided including input under voltage, over temperature, output over voltage, and output short-circuit protection.

It also features remote control and optional latching OTP and OVP.

Ericsson said that its BMR653 3+ offers twice the power of a conventional quarter-brick, and delivers 650W at 40C and 2m/s airflow.

Its electrical platform uses an optimised power-train, planar-magnetic type, with a special layout to reduce power conduction losses.

The module's mechanical assembly concept is based on the use of low resistive pins interconnecting the stacked modules to the end-user's board without any disruption in conduction.