Broadcom releases GPON portfolio
Broadcom
Broadcom GPON products
Broadcom has announced Gigabit Passive Optical Network (GPON) products from gigabit bridges to fully integrated access device capabilities.
Broadcom's GPON portfolio uses the company's processor, switch and physical layer (PHY) cores, in conjunction with a Linux and voice over IP (VoIP) software suite, enabling Fibre-to-the-Home (FTTH) and Fibre-to-the-Node (FTTN) solutions.
With the announcement, Broadcom completes its carrier access portfolio solutions for ADSL, VDSL and GPON technologies.
Broadcom's GPON solutions enable high-definition (HD) video, VoIP, high-speed internet (HSI), gaming, and higher-bandwidth provisional services such as video-on-demand (VoD) and rapid download of IP video content.
The Broadcom BCM6800 range is designed to allow more cost-effective optical-network terminals (ONTs) or optical network units (ONUs) used in conjunction with service provider passive optical networks (PONs).
The product family provides a 400MHz dual-core processor architecture; hardware-assisted gigabit bridging and routing; hardware-assisted IPsec security for virtual private network (VPN) termination; gigabit switch and PHYs; VoIP support for USB 2.0 host and devices; and support for Broadcom's wireless LAN (WLAN) devices using PCI Express.
The BCM6800 family includes TR-069 and OMCI management software and integrates the Multimedia over Coax Alliance (MoCA) standard.
This includes a MoCA media access controller (MAC), PHY transceiver and RF tuner which enable service providers to transform a subscriber's existing coax network into a home media distribution gateway.
As a result, service providers that use coax for media distribution within the home can offer whole-home digital media services that allow subscribers to securely access, store and share multiple types of digital-media content including HDTV programs, video-on-demand, digital video recorder (DVR) recordings, Internet content and VoIP.
Each solution within the BCM6800 product family is designed in a 65nm CMOS process that provides high integration, low power consumption and small footprint size.
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