Universal contact provides vertical connection
ITT Interconnect Solutions
Universal Contact
ITT Interconnect Solutions has launched a universal contact (UC) for angular alignment applications that provides a vertical electrical connection between a device and a PCB.
The ITT UC for angular alignment applications has a sloped front beam that enables a mating angle of 90deg and retains the same overall dimensions as a standard UC.
Features include 2.5mm free height with 1mm of deflection and X-Y-X movement with the mating device.
A solder well prevents wicking of flux solder into the critical beam area and side wings prevent beam overstress.
The UC also includes a domed contact for high hertz forces and 0.3N of pre-load force minimum.
The pitch between contacts is 1.35mm.
Electrical specifications include a voltage rating of up to 500V DC.
Applications include handsets, where the contacts can be used for solderless component and I/O interconnects as well as battery and antenna contacts.
Further applications include memory sticks, GPS board-to-screen interconnects, CT scanning equipment, key fobs and smoke detectors.
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