Molex announces Picoflex SMT header
Molex
Picoflex SMT header
Molex has introduced the Picoflex SMT header with positive retention latches.
It provides a robust and reliable wire-to-board connection with increased retention force for rugged applications and high-vibration environments.
Adding to Molex's extensive range of Picoflex connectors, suitable for high-density applications where space is at a premium and power and signal are required, these more rugged versions are suited to a variety of demanding applications for the industrial, automotive, medical and multimedia industries.
'The Picoflex latch design increases the retention force between the header and receptacle by at least 50 per cent, compared with our standard friction-lock header,' said Desmond Ryan, product manager at Molex.
'This greater retention force ensures a robust and reliable connection in applications where the harness can be placed under a push/pull force, or where assembly involves movement of the cable, to prevent the header and receptacle from unmating.' A typical example of where the Picoflex SMT latched header is being applied is where part of a harness protrudes from the assembly.
Without the positive retention latches, tension on the harness, especially during the final assembly process, can cause the header and receptacle to partially or completely unmate.
This partial unmating is a cause for concern during initial in-factory testing, where the results verify electrical contact and functionality but the product then fails in the field; the latched Picoflex minimises such failures.
Featuring a standard interface design, the Molex Picoflex surface-mount latched header is backward-compatible and mates with existing Picoflex 90327 receptacles.
It features a high-profile polarising peg, which avoids mis-mating of the header and receptacle and also acts as a lead-in to aid assembly.
In addition, the polyphthalamide (PPA) housing material enables the header to tolerate reflow temperatures of up to 260C.
The gold plating option, as opposed to the standard tin plating, allows easier mating and higher mating cycles, and is highly recommended for environments running at consistently high temperatures or in low-current applications.
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