Power interconnects make better use of airflow
TE Connectivity
Multi-Beam XLE and Minipak HDL connectors
Tyco Electronics has developed a range of power interconnects, comprising the Multi-Beam XLE and Minipak HDL connectors, to meet the demand for increased current density with modular power solutions.
The new designs make better use of available airflow and offer improved long-term reliability, according to the company.
Contact design and material selection have been upgraded to address challenges related to energised mate and un-mate cycles and exposure to corrosion-enhancing environments while maintaining low-millivolt drops.
The company will present a webinar entitled 'Power Interconnect Solutions: Increasing Current Density and Reliability' on 30-31 March 2010.
The webinar will cover high-performance power distribution interconnects and other topics related to heat dissipation and long-term reliability.
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