Optical socket for failure analysis testing
Aries Electronics
CSP test socket
Aries offers a CSP test socket with a window that exposes 100 per cent of the top of the device under test (DUT) for failure analysis testing in emission microscopy or optical sensor applications.
Traditionally, a hole in the socket lid only exposes a maximum of 85 per cent of the top of the DUT surface.
Available with or without filters for ultraviolet (UV), infrared and full spectrum applications, the new optical failure analysis test socket can be used for laser failure analysis microscopy testing using emission microscopy and laser signal injection microscopy (LSIM) techniques.
These failure analysis techniques are efficient, non-invasive optical analysis tools used to detect and localise certain IC failures with maximum clarity and contrast.
The techniques can be performed from either the front or back of the device.
The optical test socket line can accommodate many different optical window and lens materials, including quartz crystal, sapphire and clear plastic, depending on operational requirements.
The window on the standard socket uses a high-quality optical quartz V077 glass with a 98 per cent transmission rate from less than 260nm in the near UV through to more than 2,000nm in the infrared.
The new test socket can be matched to any existing socket footprint (from Aries or any other manufacturer), allowing an existing printed circuit board to be used for failure analysis testing or for combined testing requirements.
The socket can accommodate IC device sizes from 0.75mm and up and with an IC pitch from 0.30mm and higher.
Customers should consult Aries for device sizes greater than 40mm and for custom footprint layouts.
The standard contact system uses the patented Aries two-piece spring probes with an estimated contact life of 500,000 cycles and an operating temperature of -55C to +150C (-67F to +302F).
High-speed spring probes and conductive elastomeric Kapton interposers are available for radio-frequency applications from 1GHz to more than 40GHz.
As with all Aries sockets, the new CSP optical test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing is dependent on the number of device leads and the type of device pitch.
Typical pricing for an optical test socket with 70 leads starts at USD815 (GBP541).
Delivery is 20 working days.
More stories
Aries offers small-footprint probe test sockets
Aries Electronics is offering machined high-frequency centre probe test sockets that are suitable for a variety of ball grid array (BGA), chip-scale package (CSP) and micro land frame (MLF) packages.
Kelvin test socket provides minimal signal loss
Aries Electronics is offering a Kelvin test socket that handles devices with a lead pitch down to 0.4mm.
Aries adapters accommodate 0.40mm board pitches
Aries Electronics has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40mm.
Aries adds model to Switch-A-Pitch Adapter range
Aries Electronics has expanded the BGA Switch-A-Pitch Adapter range to include a model that adapts to lower pitch bottoms.
Aries CSP extends burn-in socket range
Aries Electronics has expanded its line of CSP/MicroBGA test and burn-in sockets to include a version that accommodates devices 13mm2 or smaller, with a pitch of 0.30mm or higher.


