Bomar releases A-lign MMCX antenna RF connectors

The series will initially consist of three- and six-port parts.

Designed for high-density, cable-to-board applications, the 5mm (1.97in) centreline parts ensure the integrity of coaxial cable connections for OEMs/ODMs, especially where PCBs are stacked.

They can also reduce a manufacturer's BOM while optimising close-proximity alignment to help speed a product's time-to-market.

The A-lign Series meets all industry mechanical, electrical and environmental standards.

These PCB-mount coaxial interconnects are suited for a broad range of compact, high-density wireless applications in which package size and high performance are critical factors.

They are most frequently specified in cellular base stations and test and measurement and medical equipment.

Both male and female devices are provided with snap-together coupling to facilitate low RF leakage and ease of assembly.

Female parts featuring Bomar's E-Snap PC mounting technology are optionally available.

These connectors do not require an adhesive prior to reflow soldering as they 'snap' securely into previously solder-pasted holes for reflow soldering.

Devices feature a 50 Ohm impedance and repeatable performance to 6GHz.

A-lign interconnects are made of precision-machined brass with gold bodies to support an extremely low reflection factor with a VSWR of 1.30.

Female interconnects are provided with gold-plated beryllium/copper contacts.

All parts are supplied with a Teflon dielectric to facilitate a low-dielectric constant and for reflow soldering.

Interconnects are supplied as standard with 5mm centrelines, but custom centreline dimensions are available.

Samples are available upon request.