Aries offers small-footprint probe test sockets
Aries Electronics
High-frequency centre probe test sockets
Aries Electronics is offering machined high-frequency centre probe test sockets that are suitable for a variety of ball grid array (BGA), chip-scale package (CSP) and micro land frame (MLF) packages.
The sockets accommodate IC devices with a lead pitch of 0.30mm and have very low inductance and capacitance.
Reduced inductance, increased board density and finer pitch array packages are made possible thanks to a four-point crown or sharp point gold-plated 0.30mm pitch probe pin, spring and flanged bottom pin, which contacts the tail of the probe pin to shorten the signal path.
A signal path of 0.077in (1.96mm) allows for minimal signal loss and higher bandwidth capacity with the Aries' machined high-frequency sockets.
The solder-less pressure mount spring probes allow easy mounting of the socket to a test board and device solder ball or pad, while socket-locating posts ensure accurate positioning of the socket to the board.
The sockets are equipped with chip guides to allow exact device location and four-point edge male contacts for precise mating of the device.
The socket has a small footprint, which ensures maximum use of the test board area for increased efficiency.
Spring-loaded contacts, made of gold-plated beryllium copper, provide a long lifecycle of up to 500,000 cycles.
The socket body material is Torlon PAI and all hardware is stainless steel.
The socket's contact forces are 15g per contact on a 0.30mm to 0.35mm pitch, 16g per contact on a 0.40mm to 0.45mm pitch and 25g per contact on a 0.50mm pitch or larger.
Contact resistance is less than 40milliohms.
Probe self-inductance on the new socket is 0.51nH for large probes and 0.59nH for small probes.
The socket accepts solder ball sizes from 0.15mm to 0.93mm.
Insertion loss is 1dB to 10.1GHz for a larger probe at 0.80mm pitch and 1dB to 18.7GHz for a smaller probe at 0.50mm pitch.
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