Aries CSP extends burn-in socket range
Aries Electronics
Aries CSP/MicroBGA socket
Aries Electronics has expanded its line of CSP/MicroBGA test and burn-in sockets to include a version that accommodates devices 13mm2 or smaller, with a pitch of 0.30mm or higher.
The CSP socket incorporates a simplified pressure pad compression design for a greater range of movement without over compressing the device.
This makes the socket suitable for testing very small and/or fragile devices without damaging them.
The pressure pad on the socket is adjustable with the lid open or closed by using the included hex key, and can handle device thickness variations up to 1mm.
The ability to adjust the compression force on the device enables the operator to fine tune the pressure pad force - helpful when trying to overcome co-planarity issues with the device or test board.
The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash drives by using machined (for small quantities) or custom-moulded (for large quantities) pressure pads and interposers.
With a signal path of 0.077in (1.96mm), the CSP/MicroBGA socket provides minimal signal loss for higher bandwidth capability.
The cost-efficient socket is easily mounted and removed to and from the BIB (burn-in-board), due to solderless pressure-mount compression spring probes precisely located by two moulded plastic alignment pins and mounted with four stainless-steel screws.
In addition, the socket's small size allows the maximum number of sockets per BIB and BIBs per oven.
Compression spring probes are constructed of heat-treated beryllium-copper and plated with a minimum of 30 micro inches (0.75 micro mm) of gold per MIL-G-45204 over a minimum of 30 micro inches (0.75 micro mm) of nickel per SAE-AMS-QQ-N-290.
Contact forces are 15g per contact on a 0.30 to 0.35mm pitch; 16g per contact on a 0.40 to 0.45mm pitch and 25g per contact on pitches of 0.50 mm or larger.
Operating temperature is -55C to +150C (-67F to +302F) and estimated contact life is a minimum of 500,000 cycles.
Moulded components are UL94V-0 Ultem, while machined components are UL94V-0 PEEK or Torlon.
All hardware is stainless steel.
The CSP/MicroBGA test and burn-in socket is available in custom materials, platings, sizes and configurations to suit specific applications.
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