Spring-probe pins added to Yamaichi range

Besides semiconductor and sensor testing, the pins can be used in other areas, such as medical/space, application testing, failure analysis, programming, and burn-in (HAST/THB).

The task of the spring-probe pin is to establish reliable contact to different IC packages such as QFP, BGA, QFN, LGA, and other semiconductor components with a pitch from 0.3mm (ultra-low pitch) to 2.54mm.

Other possible applications are wafer-level contacting, as well as applications in board-to-board connectors and PCB testing.

The spring-probe pin contact mechanism uses the concept of the spring contact.

This contact pin combines good mechanical and electrical characteristics.

It features durable stable contact design with simultaneous lowest mechanical contact wear - in other words, no degradation of the contact force, as well as minimised contact movement on the IC component or PCB contact pad.

The pins also offer low contact resistance (<50 mohm), even with differing surfaces.

Spring-probe pins consist of a mobile plunger, the cylindrical housing or barrel, and the spring contained within it.

The tip is available in different styles.

There are convex (spherical), conical, and crown-shaped plunger variants available.

The upper and lower plunger geometry can also be combined in different ways if needed.

There are also variants with only one movable plunger.

Different spring contact pin lengths (min 1.0 mm) and barrel diameters are available.

The smallest diameter available is 0.1mm.

Depending on customer requirements, the pins can be fabricated from different materials in order to meet both electrical and mechanical requirements.

The portfolio covers contact cycle lifetimes of >500k, typical contact forces of 25gf, working temperature ranges of - 40C to +150C, and a stable, low contact resistance of <50 mohm.