SMT test point aids functional testing
Harwin
Surface mount test points
A novel surface mount test point can be used to replace manually placed loops previously used for attaching test probes.
As more and more electronic assemblies are produced using surfacemount technologies, the need to functionally test finished goodsremains an area that can be improved.
As a step towards makingfunctional testing more straightforward, Harwin has developed anew surface mount test point that can be used to replace manuallyplaced loops previously used for attaching test probes.
Thesurface mount test point is supplied in standard tape and reelpackaging and can be placed by any mainstream surface mountplacement machine, removing the need for additional labour tohand place more traditional test loops.
The test point ismanufactured from brass with a tin plated finish for excellentsolderability and ease of assembly.
It has also been design to besmall and unobtrusive, taking up a minimal amount of printedcircuit board real estate.
Functional testing can be performed aspreviously undertaken, with test probes easily attached to theSMT test point in the normal way.
The test point is mechanicallystrong and is attached to the printed circuit board using asingle solder pad giving durability and long life should the endproduct require maintenance testing or additional work later inits life cycle.
All Harwin CAS SMT products are supplied inindustry standard tape and reel packaging to allow easy placementand cost effective delivery.
No special feeders or nozzles arerequired to place this part.
Efficient in-house manufacturingprocesses also ensure that the products are priced verycompetitively.
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