Radiall offers interconnectors for telecom apps
Radiall
SMP-MAX/Spring;IMP-Spring interconnectors
Radiall USA has introduced its range of cost-effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry.
Radiall offers four product groups and ten connector series, including the SMP-MAX, SMP-Spring, IMP-Spring and other misalignment solutions.
They address demanding wireless telecom applications required for infrastructure compact equipment such as base stations or handheld devices.
SMP-MAX large misalignment solution has an impedance-matching insulator that is optimised for a larger operating gap between connectors, making it easier for engineers to handle a maximum board-to-board distance tolerance of up to .078in (2 mm) gap without a spring.
It also features a 3deg tilt (radial travel), an operating frequency range of DC-6GHz, 1.2 max VSWR guaranteed up to 3GHz, and can handle up to 165W of power at 3GHz.
Radiall's IMP-Spring, SMP-Spring and MMBX-Spring are suitable spring-loaded solutions for increased board-to-board distance misalignment tolerances of up to .078in (2 mm) and a tilt (radial travel) of up to 4.5deg.
The products have a consistent low VSWR, down to 1.15 at 3GHz, and low RF leakage.
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