Interconnects target board-to-board applications
Mill-Max Manufacturing
Mill-Max 804 and 805 series interconnects
The new Mill-Max 804 and 805 series interconnects are suited for high-pin-count I/O and board-to-board applications.
The triple-row pin field allows for signal connections to be more densely packaged.
Also, placing and soldering one connector rather than three SIP sockets or a single- and double-row combination increases assembly efficiency and improves positional accuracy.
This triple row-package, on 0.1in (2.54mm) grid, is available from 9 to 96 position configurations (ordered in increments of three).
The 804 and 805 series connectors are RoHS compliant, featuring high-temperature thermoplastic insulators compatible with lead-free soldering temperature requirements.
Hard gold plating on both the 804 series header pins and the 805 series receptacle internal contacts provides optimum conductivity and effective wear resistance.
All Mill-Max pin headers and receptacle sockets feature high-speed screw-machined pins and receptacles manufactured to precision tolerances.
Inside each 805 series receptacle is a precision stamped beryllium copper Mill-Max 47 contact clip with a pin acceptance range of 0.025-0.037in (0.64-0.94mm) diameter or a 0.025in (0.64mm) square post and a current rating of 4.5A.
Selectively loaded pin configurations can be quoted to customer specification.
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