Schroff hybrid system combines bus technologies
Schroff UK Ltd
Hybrid system
Schroff has introduced a hybrid system that combines established bus formats such as VME or CompactPCI with MicroTCA in a single 3U-high, 19in subrack.
The hybrid system enables firms in this situation to work with two technologies in parallel.
One side of the subrack is equipped with conventional 19in components to accommodate 3U VME or 3U CompactPCI boards, while the other side consists of a MicroTCA board cage that accepts AdvancedMC single modules.
The board cage can be positioned left, right or centrally in the subrack and can have any chosen width.
The system is available with a through-connected monolithic backplane to maximise the number of free slots, or with two isolated backplanes connected via a front-panel PCIe data interface.
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