Schroff chassis conforms to new IEC standard
Schroff UK Ltd
MultipacPro chassis
Schroff has announced that the 1U versions of its MultipacPro chassis and CompactPCI and VME64x systems all conform to the new IEC 60297-3-105 standard for 1U-high 19in chassis.
Covering 'Dimensions and Design Aspects for 1U Chassis', the IEC 60297-3-105 standard defines three types of 1U-high chassis: Type A are connected to the 19in cabinet or frame at the 19in front panel only; Type B are connected to the 19in cabinet or frame at the 19in front panel and are further reinforced by means of slide rails; and Type C are connected to the 19in cabinet or frame via telescopic rails.
Both the steel and aluminium versions of Schroff's 1U-high MultipacPro chassis comply with IEC 60297-3-105 and can accommodate non-standard components and power supply units or standard circuit board formats using an internal mounting kit.
Also fully compliant are Schroff's 1U-high 19in CompactPCI and VME64x systems, which are based on the company's EuropacPro subrack.
Equipped with appropriate backplanes, ventilation units and IEEE guide rails, these shielded systems can accommodate two horizontal 160mm-deep boards, as well as horizontal rear I/O boards.
All the 1U products are available in three versions meeting the requirements of IEC 60297-3-105 Types A, B and C.
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