Bergquist releases thermal-clad IMS
Bergquist
Thermal-clad insulated metal substrates
The Bergquist Company has introduced ready-to-use thermal-clad insulated metal substrates (IMS) in standard star, square, array or strip formats.
Ten different contact patterns are available, supporting high-power LEDs from Osram, Lite-On, Lumex, Lumileds, Cree, X-Lamp, Seoul Semiconductor, Nichia and Avago Technologies.
Currently available configurations include single-device star or 36-up star arrays, as well as square boards in a 17-up strip.
Bergquist's thermal-clad IMS enhances thermal management for high-power LED lighting designs, enabling higher driving currents for increased brightness as well as ensuring lower junction temperature for greater reliability and longer operating lifetime.
Using thermal-clad IMS also enables designers to achieve the desired light output with fewer individual LEDs.
These thermal-clad power-LED substrates have more than three times the thermal conductivity of conventional FR4 PCB, achieving 1.3W/m-K to enable efficient thermal coupling to a heatsink or the surrounding ambient.
The substrates comprise a 1.57mm gauge aluminium base plate, thermally conductive di-electric and 35-micron copper circuit foil.
They are delivered ready to use, with white solder mask and HASL solder pads.
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