ATS heat sinks cool ICs in low-airflow conditions
Advanced Thermal Solutions
Maxiflow heat sinks
Advanced Thermal Solutions has introduced a line of lower-height Maxiflow heat sinks for cooling ICs and other hot components in narrow packaging and low-airflow-velocity conditions.
The sinks feature a spread fin array that maximises surface area for more effective convection cooling.
Standard sink heights are as low as 9.5mm.
The heat sinks are fabricated from extruded aluminum that minimises thermal resistance from the base to the fins and minimises weight.
Tests on Maxiflow heat sinks using an airflow rate of 100lfm (linear feet per minute) show that device-junction temperatures can be reduced by more than 40 per cent below the temperatures achieved using other heat sinks.
Low-profile Maxiflow heat sinks are provided pre-assembled with ATS Maxigrip mounting hardware.
This attachment system includes a plastic frame clip that snaps securely around the component.
A stainless-steel spring clip runs through the fin field and fastens to the frame.
The result is steady, even mounting pressure with no holes in the PCB.
These assemblies meet Telcordia GR-63-Core; ETSI 300 019; and MIL-STD-810 shock and vibration testing standards.
A thermally conductive, phase-change interface pad maximises the heat transfer from component to the cooling solution.
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