Air management systems enhance cooling in AdvancedTCA/MicroTCA shelves
Rittal
Air management systems
Rittal has developed a range of air management systems that are designed to enhance the cooling performance in AdvancedTCA and MicroTCA shelves by eliminating escaping airflow.
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The filler panel ensures cooling airflow is not wasted through escaping from any unused slots in the chassis, acting as a barricade to prevent any unused cooling air from escaping.
The air management system within the filler provides a resistance barrier to the airflow in any empty slots, raising the pressure and improving the flow to where it is most required within the active board area.
Key specifications
AdvancedTCA
• Full-specification panels for empty slots
• Panels include a plate to simulate the missing blade or PCB and baffles to prevent unwanted airflow
• Rear filler panel kits have an additional plate to prevent air passing from the front board space over the top of the backplane and into the RTM area
• Where cooling performance is not critical, filler panels can be supplied without air management accessories
MicroTCA
• Filler front panel (face plate), dummy AMC board and adjustable baffles kit available in compact, mid-size or full size, or as separate components
• Air baffles adjusted by breaking out segments to allow partial airflow, more closely simulating a populated slot than if a solid barrier is installed
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