SMT/Hybrid/Packaging show to feature MVP fixture
KIC Thermal Profiling
MVP profile fixture
KIC's MVP profile fixture is ideal for viewing changes in reflow ovens and determining how those changes affect the profile of production boards.
Multi Components will highlight the MVP profile fixture at the upcoming SMT/Hybrid/Packaging Exhibition, to take place 8-10 June 2010 in Nuremberg, Germany.
The KIC MVP uses embedded-sensor technologies that accurately measure the profile of an individual PCB without the need to use the actual PCB beyond the initial program run.
With the MVP, there is no second guessing how the changes observed in the oven environment will affect the profile on the production board.
Changes are instantly displayed on a profile graph, along with a single number that tells the operator whether the profile is in spec.
When the MVP detects an out-of-spec situation, the software will inform the technician how to adjust the oven in order to achieve an in-spec process and quickly resume production.
The MVP works with KIC's SlimKIC and KIC Explorer profiler lines.
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