Contax releases EXR100T X-ray inspection system
Contax
EXR100T X-ray inspection system
Contax has introduced the EXR100T, a real-time high resolution X-ray system that addresses the inspection needs of BGA, CSP, flip chip and semi-conductor inspection applications.
It uses the 100KV X-ray tube and a high-resolution image intensifier to inspect boards or products up to 400 x 400mm.
The EXR100T features movement in X, Y and Z and also has tilt for angular views.
Touch-screen controls precisely control the X-ray parameters.
The EXR100T's software features BGA void analysis, BGA ball measurement and 3D rendering.
The results can be logged for future analysis and images can be captured and stored as required.
The entire system is housed in a safety cabinet, enabling fast and easy installation.
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