APR-5000 XL/XLS software reduces rework cycle time

The total productivity of the unit has been increased by reducing rework cycle time and protecting the component under rework from thermal damage.

The design permits a lower nozzle temperature to achieve the same required temperature at the solder joints or balls, while reducing BGA lid temperatures.

The APR-5000 XL/XLS is able to manage the narrow lead-free process window without using excessive peak temperatures that may damage components, connectors, adjacent solder joints and the PCB substrate.

During the rework process, the APR enables the simultaneous use of the inner and outer preheaters at programmable temperatures.

This provides faster profiling and precise thermal control across critical assembly regions.

In most applications, the preheater nozzle and reflow top nozzle can be used at the same temperature in the final zones to achieve target temperatures.

New software simplifies rework for a faster, safer and more repeatable performance,.

The APR-5000 XL/XLS Array Package Rework System provides large-board capability with small-board precision.

This system performs precise rework of a range of PCBs and component types, from large boards up to 24.5 x 24.5in (622 x 622mm) to components down to 0.020 x 0.010in (0.51 x 0.25mm).

Also featured is a Split Vision System, which allows operators to simultaneously view the opposite corners of a component, including splitting on rectangular components, with high-powered magnification to make placement and registration fast and accurate.