Nihon Superior unveils lead-free solder paste
Nihon Superior
SN100C P800
Nihon Superior has introduced the SN100C P800 power semiconductor lead-free solder paste.
SN100C P800 D2 is a reliable paste for device assembly that is designed to reduce voiding and reflow time.
With SN100C P800, reflow cycle times are shortened and wettability is increased, said Nihon.
The paste has high-speed printability, even for large apertures.
The lead-free paste also prevents shrinkage cavities and IMC growth, with no shrinkage defects.
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