Nihon solder exhibits high ductility
Nihon Superior
SN100C lead-free solder
Nihon Superior has announced the SN100C high-ductility, lead-free solder that provides high impact strength.
A high-ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
The fracture area of SN100C is similar to that of Sn-37Pb at the shear speed of 100mm/s but the fracture area for Sn-3.0Ag-0.5Cu is smaller than Sn-37Pb.
The fracture area of SN100C is slightly smaller than that of Sn-37Pb at the shear speed of 1,000mm/s, while the Sn-3.0Ag-0.5Cu fracture area is much less than Sn-37Pb due to its low ductility and brittleness.
Comparing the fracture areas, Sn-37Pb>SN100C>Sn-3.0Ag-0.5Cu.
In general, a solder alloy with a larger fracture area can absorb greater energy and shock due to its ductility and ability to deform.
Additionally, Sn-3.0Ag-0.5Cu is brittle and resistant to deformation, where SN100C is ductile like Sn-37Pb.
SN100C (Sn-0.7Cu-0.05Ni+Ge) has no shrinkage defects, reduced copper erosion, and its high ductility inhibits growth of the IMC layer.
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