Nihon offers lead-free solder paste for 0402 parts

The SN100C P520 D5 lead-free solder paste with the compliant SN100C alloy is claimed to reduce shrinkage defects, slow the intermetallic growth and offer high-impact strength for 0402 components.

Additionally, the paste is said to provide reflow with minute solder volumes, wetting on all common substrates (including nickel and brass), minimal cracking of flux residue and hot slump performance.

The recent development of densely populated boards has meant that it is essential to improve the quality of high-density mounting, such as the application of minimal components represented by the 0402 metric package, also known as 01005, fillet-less mounting and narrow pitch mounting.

In contrast, there have been reductions in joint strength as a result of extremely small pads and solder volumes, caused by narrowed components and land, and fillet-less mounting.

Therefore, using a ductile alloy that is compliant with narrow pitch mounting of micro components and a solder paste with stable printing and reflow characteristics is a requirement.