SM packages suit optical devices in aerospace apps

The fully hermetic, low-profile, leadless surface-mount (SMT) packages feature improved electrical performance and incorporate a metal plug in the base that allows a direct ground path for enhanced electrical performance.

Anticipated performance is DC to 30GHz and the first package offered has a 5 x 5mm outer dimension and 28 I/Os.

There are plans for other configurations, including packages with 4 x 4, 6 x 6 and 8 x 8mm outer dimensions.

All SM packages meet stringent MIL-STD requirements for hermeticity.

Additions to the SM range will be offered as standard products, with samples and volume production quantities available in the third quarter of this year.

The SM packages match industry-standard outlines, enabling them to be used as direct replacements for traditional quad flat-package designs.

They can be used in place of plastic over-moulded packages in applications where an air cavity is desired.

The air cavity provides improved microwave performance, allows for ease of rework and repair, and is ideal for prototyping.

In addition, air cavities are often necessary for sensors and other devices that need to respond to movement.