DEK introduces wafer-processing system

Specifically for processing thinned silicon wafers, the system offers process capability of Cp>2 at +/-12.5um, with speed and acceleration control.

The Galaxy thin wafer system features a wafer pallet which secures wafers as thin as 75um during transport and processing.

Approximately 400mm2, the DEK wafer pallet is flat to less than 10um and can accommodate wafers of up to 300mm.

The use of porous materials allows thinned wafers to be held securely while being processed with packaging techniques, including Direkt ball placement, Direkt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation.

Combining a rail system with transport technology, the Galaxy Thin Wafer System is designed to accommodate the transfer of the wafer-loaded pallet in and out of the mass-imaging platform.

The system's toothed flat-belts are driven by a servo-motor and supply a large contact area for support and stability of the wafer pallet to control its speed, acceleration and positioning, the company said.

DEK's Direkt Coat process for deposition of 25um-thick die attach adhesives and other coatings has a process capability of Cp>2 at +/-12.5um and a total thickness variation of 7um on 150um thin wafers up to 200mm in diameter.

Additional process extension includes first pass yield ball placement of 200um spheres at a 3000um pitch, precision thermal interface materials deposition and wafer bumping.