Package rework system provides controlled heating

OK International is introducing the new APR-5000-DZ array package rework system for BGA and SMT rework.

This latest addition to the company's APR-5000 series delivers highly targeted and controlled heating for rework of high thermal demand boards including lead-free and multilayer assemblies up to 305 x 305mm.

The APR-5000-DZ system has a dual-convection bottom-side heater that enables faster rework while controlling the temperature to levels required by component and material manufacturers' specifications.

The dual convection heater consists of both a large-area and small- area (localised) heaters.

In concert with the top-side convection heater, faster heating rates with small temperature deltas are achieved during rework.

Additionally, the proprietary nozzle design serves to protect components directly adjacent to the rework zone as well as other temperature-sensitive devices on the board.

The APR-5000-DZ provides users with the capability to rework components with a 0.4mm pitch.

Additionally, new nozzle technology enables the system to rework components where vacuum pick-up is not an option.

In addition to BGA and CSP, odd-form components including through-hole parts, connectors, potentiometers, sockets, and even package-on-package (PoP) devices, can be removed and placed effectively and consistently.

The APR-5000-DZ supports the rework process with precision alignment control and an integrated vision system.

A new strobe light facilitates viewing the dual image of both component and board.

The APR-5000-DZ includes an industrial PC with operating system and application software, LCD monitor, keyboard and mouse for rework.

Its application software provides the user with highly intuitive, easy to use profiling tools.

Once profiles are established they can be saved.

Operators are seamlessly "coached" with the software's user prompts.

The APR system software can call up a profile and contains step by step instructions that quickly detail the action required for rework.

The profiles can also be shared across multiple APR-5000-DZ systems with cross-system repeatability to 5C.

The system is ideal for small, high-density boards used in such products as mobile phones, handheld instruments and personal media players.

The APR series of rework systems also includes the APR-5000-XLS for rework of boards up to 610 x 610 mm.

These systems are a popular and fast growing choice for advanced package rework and are supported world-wide by experienced applications and service expertise.