Underfill encapsulant for semiconductor packaging

Developed to meet cutomers’ technical requirements, Lord has been able to present the material with a significant cost reduction, it claims.

Comparable with underfills such as Henkel 4256, the ME-555 offers good flow characteristics, thermal cycling reliability and low Coefficient of Thermal Expansion (CTE).

Lord ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip-chip devices.

It is formulated to reduce warpage and with the necessary structural strength to handle over-moulding processes.

Designed with optimum surface tension and viscosity to achieve full coverage without producing bulky fillet or creeping on top of the device, Lord ME-555 will flow consistently without voids while maintaining a fast flow rate.

It can be used under CSP/BGAs and small dies with stand-off heights as small as 25 microns.

Owing to the low CTE, ME-555 minimises the possibility of cracking and greatly improves reliability during temperature cycling and temperature shock.

Further, Lord ME-555 provides good adhesion to laminate, ceramic, solder-mask and metal surfaces, as well as a high Tg and high fracture toughness, which provides a strong mechanical protection for the entire device and prevents premature failures in the package.