Silicone system eases potting and encapsulation

The latest two-part condensation-cured liquid silicone system from Master Bond is ideal for the potting and encapsulation of voltage regulators, high voltage transformers and optical and electronic assemblies.

Master Sil 150 has good thermal stability combined with excellent flexibility.

It has a Shore A hardness of 40 and its elongation at break is 230%.

Low viscosity ensures complete fill-in around complicated parts to provide excellent electrical insulation and resistance to shock.

The coefficient of thermal expansion is 0.11%/K and its linear shrinkage is less than 0.4%.

With the addition of the curing agent, Master Sil 150 cures at room temperature to a tough, resilient silicone rubber.

Its unique mechanical and electrical properties protect sensitive electronic components and assemblies from dust, moisture, ozone, thermal shock and vibration.

Master Sil 150 has a service temperature range from -50 to over +205C.

Its excellent thermal conductivity of 314kJ/cm.s.K is ideal for potting and encapsulation applications.

The electrical insulation properties include a volume resistivity of 500Tohm.cm, a dielectric strength of 18kV/mm together with a 2.9 relative permittivity and 0.003 dissipation factor at 1MHz.

Master Sil 150 will cure in contact with virtually all types of materials without inhibition.