Rogers exhibits advanced circuit materials

Highlights included RO4000 Lopro laminates that implement a special interface technology to enable the use of a very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials.

RO4000 Lopro laminates combine the electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and good passive intermodulation (PIM) characteristics.

The show also featured the RT/duroid 5880LZ material, a PTFE composite designed for exacting stripline and microstrip circuit applications.

The filler system results in a low density (1.37gm/cm3), lightweight material making it a suitable choice for high-performance weight sensitive applications such as airborne antennas.

RT/duroid 5880LZ laminate has a dielectric constant (Dk) of 1.96 at 10GHz.

With a TCDK (thermal coefficient of dielectric constant) of 22PPM/C, 5880LZ enables consistent circuit performance and stable dielectric constant versus temperature.

In addition, the dielectric constant is uniform from panel to panel and constant over a wide frequency range.

Its low dissipation factor extends the use of RT/duroid 5880LZ to Ku-band and above.

Other commercial grade materials on display included RO3000 laminates featuring low dielectric loss for high-frequency applications, and R/flex 8080 Photoimageable Covercoat materials designed to provide uniform coverage in mass production applications.

R/flex 8080 enables printed circuit board manufacturers to achieve ultra-fine, high-precision etch patterns that have traditionally been unattainable through conventional screen printing, said Rogers.

The photoimageable covercoat materials provide outstanding imaging resolution, flexibility and creaseability, as required for developing today's high-density flexible printed circuits, adds the company.