Paste keeps pins clean for testing

Cookson Electronics Assembly Materials is pleased to announce the launch of its Alpha OM-338 PT lead-free no-clean solder paste.

This new product offers unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.

"Lead-free pastes have an inherent difficulty with pin test yields".

"Thanks to our global market intelligence gathering, and world class team of product formulators, OM-338 PT has proven to be a very promising innovation", said Mitch Holtzer, Cookson Electronics' Global Product Manager.

"Alpha OM-338 PT is targeted to both EMS and OEM customers using inline circuit testing".

"OM-338PT was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield".

Alpha OM-338 PT lead-free no-clean solder paste is the right product for electronics manufacturers who are currently dissatisfied with their lead-free paste selection, or who have yet to make a decision as the RoHS compliance deadline of 1st July 2006 approaches.

In addition to excellent pin testability with virtually no residue on pins, OM-338 PT offers high print speeds (up to 150mm/s, on 12mil squares and 10mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colourless flux residue yielding excellent joint appearance, and excellent low voiding and antislumping characteristics.