LED encapsulant material is self bonding
Techsil
IVS4742 LED encapsulant material
Momentive Performance Materials has developed IVS4742, a self-bonding LED encapsulant material with a viscosity and clarity that enables low-pressure direct-onboard lens moulding.
Direct-onboard lens moulding combines the potting, lens-moulding and mounting steps into a single process.
IVS4742 is a two-component, addition-cure silicone rubber designed for optical-device coating.
Its low viscosity can allow low pressure, which helps minimise risk for LED damage.
Its cure speed typically enables IVS4742 to be demoulded after 2min at 150C, with further post cure required to assure completion of cure and adhesion to substrates.
The mould itself also needs to feature ease of demould properties, for example a Teflon layer.
Key features of the material include: transparency; low viscosity allowing for good flow; 1:1 mix ratio by weight; fast curing with heat and adhesion to parts; and adhesion to PPA.
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