Lead-free range aims for wider process window

With a 2006 deadline looming, you should be seriously looking at the transition to lead-free soldering - and as materials development moves towards the goal of a wider process window it will help with implementation of the more demanding process.

Although it has not been possible to find a drop-in solution in terms of processing temperature, Cookson Electronics has focused its research on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.

This will make future electronics assembly more flexible than many manufacturers had envisaged, based on experience of only a few years ago.

The Alpha OM-300 range of solder pastes gives the high performance similar to leaded no-clean pastes to provide a high yielding, high throughput process, with development emphasis at all stages of the production line.

For wave solder flux the Alpha EF-series provides a true environmentally friendly solution, with lead-free compatibility and ultralow VOC emissions.

These revolutionary fluxes have been developed for even the most stringent reliability requirements, by incorporating rosin into the water-based system.

Wave solder bar development has been continued to provide high fluidity, low drossing performance - both of greater importance for the lead-free process.

Alpha Fluitin 1532 SAC alloy cored solder wire provides fast wetting with high residue reliability properties.

This range provides Cookson with a full line of lead-free material solutions to allow a minimal impact transition to lead-free compliance.