Laminates have reverse-treated copper foil option

The RO4000 Lopro laminates can be manufactured with very low profile reverse-treat copper foil, while maintaining copper peel strength equal to or better than standard RO4000 materials.

RO4000 Lopro laminates combine the electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and passive intermodulation (PIM) characteristics.

The laminates feature a low Z-axis coefficient of thermal expansion (CTE) over a wide temperature range for reliable plated-thru-hole performance in multi-layer circuits.

The Lopro range is compatible with standard PCB fabrication processing and lead-free assembly temperatures.

The range supports high-speed, high-frequency circuits with low insertion loss and improved signal integrity for ATE, wireless and networking applications.

The RO4000 Lopro laminates achieve low PIM values, which are critical for antenna designs.

RO4000 Lopro laminates extend the Rogers portfolio of high-performance materials by offering improved laminate electrical performance, boosting manufacturing yields and enabling higher circuit densities.

Lopro materials are suitable for a wide range of analogue and digital applications, including antennas, microwave radio links, ATE, servers and routers.