DEK upgrades Direkt wafer coating
DEK
Direkt wafer coating
DEK has enhanced the process capability of its Direkt Coat technology by a factor of three.
With Cp>2 at +/-12.5um and a 7um total thickness variation, Direkt Coat can deposit 25um-thick coatings onto wafers as thin as 150um.
The Direkt Coat wafer backside coating technique enables faster processing times and chip footprint maximisation.
Direkt deposits materials on wafers as large as 200mm in a single stroke and exponentially by a factor of 10, improving processing speeds.
Bondline is controlled to customer specifications and the fillet is eliminated, affording a larger chip area.
According to DEK, the Galaxy Thin Wafer System incorporates robust rails and precise transport technology to accommodate a newly engineered, next-generation wafer pallet.
The pallet consists of porous materials that ensure thinned wafers remain secure and stable while being imaged during semiconductor packaging processes.
Flat to less than 10um, the pallet is 400mm square and can accommodate wafers up to 300mm in diameter and as thin as 75um.
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