Conductive epoxy holds on tight

Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity.

It offers the application convenience of a single-component system in addition to flexible cure schedules so as to best meet specific processing requirements.

It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 40MPa and a tensile shear strength over 10MPa.

EP11SIC is amazingly tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals.

It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50 to over +150C.

Master Bond Polymer System EP11SIC is supplied in the form of a silver-coloured flowable paste.

The gel time at 150C is in the order of 20-25 minutes, and cure is of the order of 40-50 minutes at 175C.

Typical performance properties include a very low volume resistivity less than 0.001ohm-cm, a surface resistance of less than 1ohm/square and a very robust thermal conductivity of 7.9W/m-K.

Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions.

Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.