Component packaging is environmentally friendly
Farnell
Component packaging
Farnell has launched biodegradable, static dissipative bags that are said to provide an environmentally friendly packaging solution for electronics.
The bags use a material that combines static protection for sensitive components with biodegradability.
The packaging was developed in collaboration with Antistat and is exclusive to Farnell.
It will replace the polythene bags currently used to package an estimated 3.6 million components despatched by Farnell in Europe each year.
With a static charge decay of <0.002s and surface resistivity of <1x1010ohms/sq, the packaging offers the same level of protection as standard ESD packaging but can be disposed of in composting facilities, reducing the impact on the environment.
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