ACM laminates feature low dissipation factor

RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5GHz.

The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fibre for excellent mechanical stability compared to PTFE woven glass.

ACM said that RO4360 laminates provide the performance and reliability designers need in a lower total PCB cost solution.

The product features low dissipation factor, generous power-handling capability and improved thermal conductivity, added ACM.

Environmentally friendly RO4360 laminate materials are RoHS compliant and compatible with standard printed circuit board processing methods.

The copper-clad laminates exhibit a high glass transition temperature (Tg) of greater than 280C and a low coefficient of thermal expansion (CTE) in the z-axis (30 PPM/C) needed for reliable plated through holes (PTHs) in multi-layer circuits.

RO4360 laminates allow designers to reduce circuit dimensions in applications where size and cost are critical.

They are suitable for engineers working on designs such as power amplifiers, patch antennas and other commercial high-frequency applications.