ACM introduces RO4730 Lopro laminates

RO4730 Lopro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.

The specially formulated RO4730 Lopro thermoset resin system incorporates a hollow microsphere filler to achieve a low weight, light density laminate, which is approximately 30 per cent lighter than woven-glass PTFE materials.

RO4730 Lopro laminates have a matched dielectric constant of 3.0, providing a lower cost solution for high-frequency circuit boards used in base station and other antennas.

RO4730 Lopro laminates feature low Z-axis co-efficient of thermal expansion (CTE of about 40PPM/C) for design flexibility.

With a temperature coefficient of dielectric constant of about 23PPM/C, the laminates provide consistent circuit performance over short-term temperature ranges.

They feature the same high glass transition temperature (Tg) as Rogers' other high-performance RO4000 laminates, greater than 280C, making them lead-free and automated-assembly compatible.

RO4730 Lopro RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole (PTH) processing.

Designed for base station and other RFID antennas, the proprietary, halogen-free laminates support longer drill-tool lifetimes than other filled materials, reducing fabrication costs.