Congatec offers computer-on-module with low power consumption for ETX applications
Conga-EAF computer-on-module (COM)
Congatec AG has introduced the Conga-EAF computer-on-module (COM), which, offering a choice of seven AMD G-series processors, is claimed to provide broad scalability for the ETX standard, as well as a good price-to-performance ratio.
Ranging from the AMD T56N 1.6GHz Dual Core (L1 cache 64KB, L2 Cache 512KB x2, 18 W) multi-core processor to the AMD G-T40R 1.0GHz (L1 cache 64KB, L2 cache 512KB, 5.5W) single-core processor with extremely low power consumption, the Conga-EAF is claimed to provide a perfect form-fit function set-up for ETX.
Direct native 32-bit PCI support from the chipset has substantial advantages with regard to PCI bus latency over comparable PCI Express bridge solutions.
Fusion architecture combines two previously separate computing functions — the central processing unit (CPU) and the graphics processing unit (GPU) — into one accelerated processor unit (APU).
- Embedded controller hub Hudson E1
- 4GB single-channel DDR3 memory
- Integrated graphics core with Universal Video Decoder 3.0 for seamless Blu-ray processing via HDCP (1080p), MPEG-2, HD and DivX (MPEG-4) videos
- Two serial ATA interfaces
- Native 32-bit PCI
- Two EIDE, four USB 2.0 ports
- Two COM, PS/2 10/100M Ethernet
- High-definition audio
- LVDS, CRT, Displayport, HDMI or DVI graphics interfaces
Congatec has introduced a tablet PC technology demonstration platform designed to illustrate the flexibility of modular programming and its ability to reduce the design time and complexity of compact industrial equipment.
Congatec has introduced a Windows Embedded Compact 7 (WEC7) version of its Conga-QMX6 Qseven module based on the Freescale I.MX6 ARM Cortex A9 processor. The module is targeted at manufacturers of mobile and ultra-mobile industrial devices, as well as medical, automotive and industrial automation applications.
Congatec has introduced the Qseven Mobility Kit, a complete starter package for the rapid prototyping of battery-powered embedded systems. The kit includes a Qseven carrier board, a 7in LVDS single-touch display with LED backlight, a battery manager, smart battery module and cable set.
Congatec has introduced Intel Celeron Dual-Core processors with third-generation Intel Core technology for the Conga-TS77 (type-six) and Conga-BS77 (type-two) COM Express modules.
Congatec’s enhanced third-generation Intel Core processor modules — available in three versions — are claimed to provide maximum graphics and processing power for both Type 2 and Type 6 pin-out.