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Polar adds flex-rigid option to PCB design system

Polar Instruments

Speedstack PCB

Polar Instruments has added a flex-rigid PCB design option to the Speedstack PCB layer-stackup design system.

This allows designers to create and accurately document PCB stackups, combining rigid and flex-rigid PCBs, and to reduce manufacturing costs through evaluation of a range of alternative materials and suppliers.

Speedflex builds flex-rigid PCB stacks in minutes, document drills, display the stacks as a 2D or 3D image and add controlled impedance, with goal-seeking, to complete the design.

Speedstack does not limit the number of layers that can be added or the number of cross-sections that can be created and compared, including coverlays, adhesives and no-flow prepreg layers.

The completed stack is documented automatically and can be exported in industry-standard file formats.

This eliminates manual errors and ensures that the PCB specifications are communicated clearly and consistently to every company and individual in the design and fabrication process.

While error-free documentation tightens control over the finished board, Speedflex also provides the flexibility for fabricators to safely reduce manufacturing costs.

With extensive libraries of materials, suppliers, costs and lead times, Speedflex can show the impact that changing materials or suppliers will have on the cost, lead time and electrical specifications of the finished board.

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