Lattice offers Chip Scale 132 BGA packaging
Lattice Semiconductor
Chip Scale 132 BGA packaging
Lattice Semiconductor has released automotive temperature-qualified (AEC-Q100) low-cost Chip Scale 132 ball grid array (BGA) packaging for the non-volatile LatticeXP2 FPGA family.
Based on Lattice's 90nm hybrid Flexiflash technology, the XP2 family's Chip Scale packaging enables the realisation of design requirements in tight form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems.
The Chip Scale 132 BGA packaging has been fully qualified and characterised to meet AEC-Q100 requirements from the Automotive Electronics Council and is available for the XP2-5 and XP2-8 devices, with 5,000 and 8,000 look-up tables (LUTs) available respectively.
Measuring 64 mm2 and 1.35mm in height, the package footprint is the smallest available for non-volatile FPGAs, according to the company.
Sean Riley, Lattice corporate vice-president and general manager of high-density solutions, said: 'Our non-volatile XP2 family in AEC-Q100-qualified, low-cost Chip Scale 132 BGA packaging is a compelling solution for automotive designers who value high-integration, source-synchronous interfaces and low power consumption for tight form-factor applications.
'This single-chip solution delivers the most FPGA value in the smallest footprint available - an important requirement for most automotive systems, including cameras, engine control modules and media centres,' he added.
Production quantities of the devices are available immediately and Lattice can provide standard production part approval process (PPAP) documentation to automotive customers requiring it.
In 100K unit volume, the Lattice Automotive XP2-5 device is priced at USD5.04 (GBP3.06).
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