Industrial temperature-qualified FPGAs launched
Lattice Semiconductor
Lattice XP2 FPGAs
Lattice Semiconductor has announced that industrial temperature-qualified versions of its non-volatile Lattice XP2 FPGAs have been released to volume production.
Based on Lattice's 90 nanometre hybrid Flexiflash technology, the XP2 family's volume production availability in industrial temperature-qualified devices enables realisation of design requirements in industrial applications such as medical imaging, robotics, human-machine interface (HMI) systems, motor control and industrial displays.
The LatticeXP2 family has been fully qualified and characterised to meet industrial temperature requirements, and is available for the full range of devices, from the smallest LatticeXP2-5 through the largest LatticeXP2-40 (5K and 40K LUTS, respectively).
Depending on the device, low-cost BGA and QFP packages that meet industrial temperature requirements are also available.
More stories
ABS announces use of Lattice FPGAs in compact digital camera reference design
Lattice Semiconductor has announced that ABS has chosen the mid-range Lattice ECP3 FPGA for use in its compact digital camera reference design.
IP core suitable for Broadcom-inclusive networks
Lattice Semiconductor has announced the immediate availability of the HiGig MAC IP core for its low-cost LatticeECP3 FPGA range, for interconnecting multiple devices to operate as one logical network.
Lattic develops 3G/4G remote radio head solution
Lattice Semiconductor and Affarii Technologies have announced that they have developed a complete 3G/4G-based Remote Radio Head (RRH) solution for wireless infrastructure customers.
Lattice announces FPGA device samples
Lattice Semiconductor Corporation has announced the availability of samples of the Lattice ECP3-150 FPGA.
Lattice offers Chip Scale 132 BGA packaging
Lattice Semiconductor has released automotive temperature-qualified (AEC-Q100) low-cost Chip Scale 132 ball grid array (BGA) packaging for the non-volatile LatticeXP2 FPGA family.
