SMD package enables smaller HV MOSFET designs

The Thinpak 8x8 has a 64mm footprint and a profile of 1mm (h), combined with benchmark low parasitic inductances.

The 1mm-high surface-mount package houses the industry-standard TO-220 die size within a leadless outline measuring 8 x 8mm and features an exposed metal drain pad for efficient removal of internally generated heat.

Its low profile will enable designers to achieve slimmer power supply enclosures.

This standard is available from Infineon and ST - named Thinpak 8x8 by Infineon and Powerflat 8x8 HV by ST.

The Thinpak 8x8 package has a source inductance of 2nH, a separate driver source connection for clean gate signals, and a thermal performance similar to the D2Pak.

As a result, the Thinpak 8x8 package enables faster and more efficient switching of power MOSFETs, and is also said to be easier to handle in terms of switching behaviour and EMI.

Infineon will initially offer three 600V CoolMOS devices in the package: 199mOhm (IPL60R199CP), 299mOhm (IPL60R299CP) and 385mOhm (IPL60R385CP).